Grinding machine×トキワ精工 - List of Manufacturers, Suppliers, Companies and Products

[Equipment Introduction] Cylindrical Grinding Machine (Okamoto OGM)

We offer a variety of grinding stones, including diamond, borazon, and WA, capable of accommodating many materials.

The secret of Tokiwa Seiko's technology, which responds to diversifying needs, lies in its wide range of in-house equipment. In cylindrical grinding, we offer various grinding wheels such as diamond, borazon, and WA, enabling us to accommodate many materials. For powder metallurgy mold punches, it is common to finish the outer diameter with a mirror surface. Typically, two processes are required: finishing the dimensions with cylindrical grinding and then polishing to achieve a mirror finish. However, at Tokiwa Seiko, we have developed a method that allows us to finish the dimensions and achieve a mirror surface simultaneously during the cylindrical grinding process, enhancing efficiency. If you have specific requests such as "I only want to rely on this equipment for processing," we can also perform pinpoint processing using available equipment. Please contact us, and we will provide updates on the machine's operational status. *For more details, please refer to the PDF or feel free to contact us.

Company：トキワ精工
Price：Other

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[Equipment Introduction] Profile Grinding Machine (Amada Washino)

It is also possible to process fine corner radii such as 0.06 to 0.08 R.

The secret of Tokiwa Seiko's technology, which responds to diversifying needs, lies in its wide range of in-house equipment. The profile grinding machine (Amada Washino GLS-135AS), as it is called "optical contour grinding machine," projects the processing area of the product 20 times larger by shining light on it, allowing for grinding that follows the shape of the product. It can grind small grooves and gear shapes, as well as cylindrical grinding for items like roll forming and stepped pins, and it is capable of processing fine corner radii of 0.06 to 0.08R. Grinding wheels used: BN, diamond, WA, etc. Wheel diameter: from φ60 to φ180 Wheel stroke: 135 mm Compatible materials: from raw materials to hardened steel, carbide, and cermet, as well as many other materials. If you have a situation where you would like to request processing with this equipment only, we can also perform pinpoint processing using available equipment. If you contact us, we will report on the machine's operating status. *For more details, please refer to the PDF or feel free to contact us.

Company：トキワ精工
Price：Other

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[Equipment Introduction] Surface Grinding Machine (Okamoto PSG63EX8)

We offer a variety of grinding stones, from diamond and borazon to general grinding stones like WA and SG, capable of handling diverse materials!

The secret of Tokiwa Seiko's technology, which responds to diversifying needs, lies in its wide range of in-house equipment. While surface grinding machines naturally grind flat surfaces, they also serve as a standard for processing various products, making them extremely important equipment that establishes Tokiwa Seiko's precision standards. The accumulated know-how allows us to minimize issues such as the so-called "drum" problem that occurs at the entrance and exit of grooves when processing thin plates and groove widths. Table size: 300*600 Grinding wheels used: We have a variety of grinding wheels available, from diamond and borazon to general wheels like WA and SG, allowing us to accommodate diverse materials. If you have specific situations such as "I only want to request processing with this equipment," we can also perform pinpoint processing using available equipment. If you contact us, we will report on the machine's operating status. *For more details, please refer to the PDF or feel free to contact us.

Company：トキワ精工
Price：Other

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[Equipment Introduction] Jig Grinding Machine (Mitsui Seiki 300G, 2 units)

It is possible to grind eccentric shafts and eccentric holes, which are usually difficult, as well as to create programs for grinding irregular inner and outer shapes.

The secret of Tokiwa Seiko's technology that meets diversifying needs lies in its wide range of in-house equipment. The "Mitsui Seiki 300G" features a grinding wheel that rotates at high speeds (up to 90,000 RPM) and has a spindle that rotates in a planetary motion, along with a very complex motion that includes vertical movement (approximately 70 mm chopping stroke). This allows for grinding of eccentric shafts and holes, which is typically difficult, as well as the creation of programs for grinding irregular inner and outer shapes. Sometimes, delicate processing is done by attaching headphones to listen to the vibrations of the workpiece while proceeding with the machining. The grinding wheels used include electroplated borazon and diamond, as well as bonded WA and vitrified CBN types with shafts. *For more details, please refer to the PDF or feel free to contact us.*

Company：トキワ精工
Price：Other

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Grinding machine×トキワ精工 - List of Manufacturers, Suppliers, Companies and Products

Grinding machine Product List

[Equipment Introduction] Cylindrical Grinding Machine (Okamoto OGM)

[Equipment Introduction] Profile Grinding Machine (Amada Washino)

[Equipment Introduction] Surface Grinding Machine (Okamoto PSG63EX8)

[Equipment Introduction] Jig Grinding Machine (Mitsui Seiki 300G, 2 units)

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